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TEILNUMMER DES HERSTELLERS
9-1437537-3
BESCHREIBUNG
CONN IC DIP SOCKET 3POS GOLD
DETAILIERTE BESCHREIBUNG
3 (1 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
HERSTELLER
TE Connectivity AMP Connectors
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
Lagerbestände
Technische Daten
Mfr
TE Connectivity AMP Connectors
Series
800
Package
Bulk
Product Status
Active
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
3 (1 x 3)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
25.0µin (0.63µm)
Contact Material - Mating
Copper Alloy
Mounting Type
Through Hole
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin-Lead
Contact Finish Thickness - Post
80.0µin (2.03µm)
Contact Material - Post
Copper Alloy
Housing Material
Polyester
Operating Temperature
-55°C ~ 105°C
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
UL94 V-0
Contact Resistance
10mOhm
Base Product Number
1437537
Umweltverträgliche Exportklassifikationen
RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
Vendor Undefined
ECCN
EAR99
HTSUS
8536.69.4040
Andere Namen
-
Kategorie
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/TE Connectivity AMP Connectors 9-1437537-3
Dokumente und Medien
Product Drawings
1(1437539-2 Drawing)
Menge Preis
-
Stellvertreter
-