Übersicht der Teilenummer

TEILNUMMER DES HERSTELLERS
528-AG12D
BESCHREIBUNG
CONN IC DIP SOCKET 28POS TIN
DETAILIERTE BESCHREIBUNG
28 (2 x 14) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Tin Through Hole
HERSTELLER
TE Connectivity AMP Connectors
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
425

Technische Daten

Mfr
TE Connectivity AMP Connectors
Series
500
Package
Bulk
Product Status
Active
Type
DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
28 (2 x 14)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Tin
Contact Finish Thickness - Mating
-
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin
Contact Finish Thickness - Post
-
Contact Material - Post
Beryllium Copper
Housing Material
Polyester
Operating Temperature
-55°C ~ 105°C
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
UL94 V-0
Contact Resistance
10mOhm
Base Product Number
528

Umweltverträgliche Exportklassifikationen

RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
Vendor Undefined
ECCN
EAR99
HTSUS
8536.69.4040

Andere Namen

4-1437532-1
2266-528-AG12D

Kategorie

/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/TE Connectivity AMP Connectors 528-AG12D

Dokumente und Medien

Product Drawings
1(TXR18 Drawing)

Menge Preis

-

Stellvertreter

-