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ChinaPA0121-S
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
PA0121-S
BESCHREIBUNG
LQFP-128/PQFP-128 (0.5MM PITCH,
DETAILIERTE BESCHREIBUNG
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
2 Weeks
EDACAD-MODELL
STANDARDPAKET
Lagerbestände
Technische Daten
Mfr
Chip Quik Inc.
Series
Proto-Advantage PA
Package
Bulk
Product Status
Active
Type
LQFP
Number of Positions
128
Pitch
0.020" (0.50mm)
Outer Dimension
1.950" L x 1.350" W (49.53mm x 34.29mm)
Inner Dimension
0.787" L x 0.551" W (20.00mm x 14.00mm)
Thermal Center Pad
-
Material
Stainless Steel
Thickness
0.0040" (0.102mm)
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8515.19.0000
Andere Namen
-
Kategorie
/Product Index/Soldering, Desoldering, Rework Products/Solder Stencils, Templates/Chip Quik Inc. PA0121-S
Dokumente und Medien
Datasheets
()
Video File
1(Prototyping with Solder Stencils - Another Teaching Moment | allaboutcomponents.com Electronics)
HTML Datasheet
1(PA0121-S)
Menge Preis
QUANTITÄT: 1
Einzelpreis: $11.59
Verpackung: Bulk
MinMultiplikator: 1
Verpackung: Bulk
MinMultiplikator: 1
Stellvertreter
-