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TEILNUMMER DES HERSTELLERS
70-1608-0804
BESCHREIBUNG
SOLDER PASTE NO CLEAN 100GM
DETAILIERTE BESCHREIBUNG
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 3.53 oz (100g)
HERSTELLER
Kester Solder
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
Lagerbestände
Technische Daten
Mfr
Kester Solder
Series
R276
Package
Bulk
Product Status
Active
Type
Solder Paste
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
-
Melting Point
423 ~ 424°F (217 ~ 218°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
3
Process
Lead Free
Form
Syringe, 3.53 oz (100g)
Shelf Life
6 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
32°F ~ 50°F (0°C ~ 10°C)
Shipping Info
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Base Product Number
70-1608
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8311.90.0000
Andere Namen
-
Kategorie
/Product Index/Soldering, Desoldering, Rework Products/Solder/Kester Solder 70-1608-0804
Dokumente und Medien
Datasheets
1(R276 Series Datasheet)
Other Related Documents
1(Alloy Temperature Chart)
MSDS Material Safety Datasheet
1(R276 Lead-free Solder Paste SDS)
HTML Datasheet
1(R276 Series Datasheet)
Menge Preis
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Stellvertreter
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