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TEILNUMMER DES HERSTELLERS
70-3205-1810
BESCHREIBUNG
SOLDER PASTE NXG1 NO CLEAN 500GM
DETAILIERTE BESCHREIBUNG
Lead Free No-Clean Solder Paste Sn99.3Cu0.7 (99.3/0.7) Jar, 17.64 oz (500g)
HERSTELLER
Kester Solder
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
Lagerbestände
Technische Daten
Mfr
Kester Solder
Series
NXG1
Package
Bulk
Product Status
Obsolete
Type
Solder Paste
Composition
Sn99.3Cu0.7 (99.3/0.7)
Diameter
-
Melting Point
441°F (227°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
-
Process
Lead Free
Form
Jar, 17.64 oz (500g)
Shelf Life
8 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
32°F ~ 50°F (0°C ~ 10°C)
Shipping Info
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Base Product Number
70-3205
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8311.90.0000
Andere Namen
-
Kategorie
/Product Index/Soldering, Desoldering, Rework Products/Solder/Kester Solder 70-3205-1810
Dokumente und Medien
Datasheets
1(NXG1 Series Datasheet)
Other Related Documents
1(Alloy Temperature Chart)
PCN Obsolescence/ EOL
1(DK OBS NOTICE)
HTML Datasheet
1(NXG1 Series Datasheet)
Menge Preis
-
Stellvertreter
-