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ChinaSMDLTLFP250T4
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
SMDLTLFP250T4
BESCHREIBUNG
SOLDER PASTE LOW TEMP T4 250G
DETAILIERTE BESCHREIBUNG
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 8.8 oz (250g)
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
4 Weeks
EDACAD-MODELL
STANDARDPAKET
Lagerbestände
Technische Daten
Mfr
Chip Quik Inc.
Series
-
Package
Jar
Product Status
Active
Type
Solder Paste
Composition
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter
-
Melting Point
281°F (138°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
4
Process
Lead Free
Form
Jar, 8.8 oz (250g)
Shelf Life
6 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)
allaboutcomponents.com Storage
Refrigerated
Shipping Info
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Base Product Number
SMDLTL
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
3810.10.0000
Andere Namen
-
Kategorie
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. SMDLTLFP250T4
Dokumente und Medien
Datasheets
1(SMDLTLFP250T4 Data Sheet)
MSDS Material Safety Datasheet
1(SMDLTLFP Series)
HTML Datasheet
1(SMDLTLFP250T4 Data Sheet)
Menge Preis
QUANTITÄT: 1
Einzelpreis: $83.95
Verpackung: Jar
MinMultiplikator: 1
Verpackung: Jar
MinMultiplikator: 1
Stellvertreter
-