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Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
1963841-2
BESCHREIBUNG
QSFP SINGLE PCI EXTRUSION HS 4
DETAILIERTE BESCHREIBUNG
Heat Sink QSFP Board Level
HERSTELLER
TE Connectivity AMP Connectors
STANDARD LEADTIME
18 Weeks
EDACAD-MODELL
STANDARDPAKET
Lagerbestände
Technische Daten
Mfr
TE Connectivity AMP Connectors
Series
-
Package
Bag
Product Status
Active
Type
Board Level
Package Cooled
QSFP
Attachment Method
Adhesive
Shape
Rectangular, Pin Fins
Length
1.801" (45.74mm)
Width
0.738" (18.75mm)
Diameter
-
Fin Height
0.165" (4.20mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
-
Thermal Resistance @ Natural
-
Material
-
Material Finish
-
Base Product Number
1963841
Umweltverträgliche Exportklassifikationen
RoHS Status
RoHS Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8538.90.8180
Andere Namen
-
Kategorie
/Product Index/Fans, Thermal Management/Thermal/Heat Sinks/TE Connectivity AMP Connectors 1963841-2
Dokumente und Medien
Video File
1(TE Connectivity High Speed Pluggable I/O Solutions | allaboutcomponents.com Daily)
Product Drawings
1(1963841 Drawing)
Menge Preis
QUANTITÄT: 1000
Einzelpreis: $3.60778
Verpackung: Bag
MinMultiplikator: 1000
Verpackung: Bag
MinMultiplikator: 1000
Stellvertreter
-