Übersicht der Teilenummer

TEILNUMMER DES HERSTELLERS
HS-MA3-R1-SET-R1
BESCHREIBUNG
HEATSINK MARS MA3
DETAILIERTE BESCHREIBUNG
Heat Sink FPGA Top Mount
HERSTELLER
Enclustra FPGA Solutions
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
1

Technische Daten

Mfr
Enclustra FPGA Solutions
Series
Mars MA3
Package
Bag
Product Status
Obsolete
Type
Top Mount
Package Cooled
FPGA
Attachment Method
-
Shape
-
Length
-
Width
-
Diameter
-
Fin Height
-
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
-
Thermal Resistance @ Natural
-
Material
-
Material Finish
-
Shelf Life
-
Base Product Number
HS-MA3

Umweltverträgliche Exportklassifikationen

Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8473.30.5100

Andere Namen

2879-HS-MA3-R1-SET-R1
EN102066

Kategorie

/Product Index/Fans, Thermal Management/Thermal/Heat Sinks/Enclustra FPGA Solutions HS-MA3-R1-SET-R1

Dokumente und Medien

PCN Obsolescence/ EOL
1(DK OBS NOTICE)

Menge Preis

-

Stellvertreter

-