English
Spain
Rusia
Italy
ChinaDPF314-998Z
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
DPF314-998Z
BESCHREIBUNG
CONN IC DIP SOCKET 14POS TINLEAD
DETAILIERTE BESCHREIBUNG
14 (2 x 7) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Tin-Lead Through Hole
HERSTELLER
Amphenol ICC (FCI)
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
Lagerbestände
Technische Daten
Mfr
Amphenol ICC (FCI)
Series
DPF3
Package
Bag
Product Status
Obsolete
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
14 (2 x 7)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Tin-Lead
Contact Finish Thickness - Mating
200.0µin (5.08µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin-Lead
Contact Finish Thickness - Post
200.0µin (5.08µm)
Contact Material - Post
Brass
Housing Material
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature
-
Termination Post Length
0.175" (4.45mm)
Material Flammability Rating
UL94 V-0
Contact Resistance
-
Base Product Number
DPF314
Umweltverträgliche Exportklassifikationen
RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Andere Namen
-
Kategorie
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Amphenol ICC (FCI) DPF314-998Z
Dokumente und Medien
Datasheets
1(DPF3 Series)
PCN Obsolescence/ EOL
1(Multiple Devices/Sockets 04/Dec/2008)
HTML Datasheet
1(DPF3 Series)
Menge Preis
-
Stellvertreter
-