Übersicht der Teilenummer

TEILNUMMER DES HERSTELLERS
508-AG10D-ESL
BESCHREIBUNG
CONN IC DIP SOCKET 8POS GOLD
DETAILIERTE BESCHREIBUNG
8 (2 x 4) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
HERSTELLER
TE Connectivity AMP Connectors
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
1,200

Technische Daten

Mfr
TE Connectivity AMP Connectors
Series
500
Package
Tube
Product Status
Obsolete
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
8 (2 x 4)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
5.00µin (0.127µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
5.00µin (0.127µm)
Contact Material - Post
Brass
Housing Material
-
Operating Temperature
-55°C ~ 125°C
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
-
Contact Resistance
10mOhm
Base Product Number
508-A

Umweltverträgliche Exportklassifikationen

RoHS Status
RoHS Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
Vendor Undefined
ECCN
EAR99
HTSUS
8536.69.4040

Andere Namen

1-1437535-3
1-1437535-3-ND

Kategorie

/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/TE Connectivity AMP Connectors 508-AG10D-ESL

Dokumente und Medien

Datasheets
1(500 Series)
Environmental Information
1(1-1437535-3 Statement of Compliance)
PCN Obsolescence/ EOL
1(Mult Devs 12/Jul/2021)
HTML Datasheet
1(500 Series)

Menge Preis

-

Stellvertreter

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