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China550-10-292M20-001152
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
550-10-292M20-001152
BESCHREIBUNG
BGA SOLDER TAIL
DETAILIERTE BESCHREIBUNG
292 (20 x 20) Pos BGA Socket Gold Through Hole
HERSTELLER
Preci-Dip
STANDARD LEADTIME
20 Weeks
EDACAD-MODELL
STANDARDPAKET
Lagerbestände
Technische Daten
Mfr
Preci-Dip
Series
550
Package
Bulk
Product Status
Active
Type
BGA
Number of Positions or Pins (Grid)
292 (20 x 20)
Pitch - Mating
0.050" (1.27mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
10.0µin (0.25µm)
Contact Material - Mating
Brass
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.050" (1.27mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
10.0µin (0.25µm)
Contact Material - Post
Brass
Housing Material
FR4 Epoxy Glass
Operating Temperature
-55°C ~ 125°C
Termination Post Length
0.086" (2.20mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
1 A
Contact Resistance
10mOhm
Base Product Number
550-10
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Andere Namen
-
Kategorie
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Preci-Dip 550-10-292M20-001152
Dokumente und Medien
Datasheets
()
Video File
1(PRODUCT DESIGN TIPS v017 microPGA Sockets and BGA Adapters)
Environmental Information
1(Preci-Dip Regulatory Info)
HTML Datasheet
1(550-10-yyyMxx-zzz152)
Menge Preis
QUANTITÄT: 648
Einzelpreis: $24.18799
Verpackung: Bulk
MinMultiplikator: 648
Verpackung: Bulk
MinMultiplikator: 648
Stellvertreter
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