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ChinaIPC0199-S
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
IPC0199-S
BESCHREIBUNG
BGA-8 (0.5 MM PITCH 2 X 1 MM BOD
DETAILIERTE BESCHREIBUNG
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
4 Weeks
EDACAD-MODELL
STANDARDPAKET
Lagerbestände
Technische Daten
Mfr
Chip Quik Inc.
Series
Proto-Advantage IPC
Package
Bulk
Product Status
Active
Type
BGA
Number of Positions
8
Pitch
0.020" (0.50mm)
Outer Dimension
1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension
0.079" L x 0.039" W (2.00mm x 1.00mm)
Thermal Center Pad
-
Material
Stainless Steel
Thickness
0.0040" (0.102mm)
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
7326.90.8688
Andere Namen
-
Kategorie
/Product Index/Soldering, Desoldering, Rework Products/Solder Stencils, Templates/Chip Quik Inc. IPC0199-S
Dokumente und Medien
Video File
1(Prototyping with Solder Stencils - Another Teaching Moment | allaboutcomponents.com Electronics)
Menge Preis
QUANTITÄT: 1
Einzelpreis: $12.93
Verpackung: Bulk
MinMultiplikator: 1
Verpackung: Bulk
MinMultiplikator: 1
Stellvertreter
-