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ChinaFI-XPB30SL-HF10
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TEILNUMMER DES HERSTELLERS
FI-XPB30SL-HF10
BESCHREIBUNG
CONN RCPT 30P 0.039 GOLD SMD R/A
DETAILIERTE BESCHREIBUNG
30 Position Receptacle Connector 0.039" (1.00mm) Board Edge, Cutout; Bottom Mount, Surface Mount, Right Angle Gold
HERSTELLER
JAE Electronics
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
1
Lagerbestände
Technische Daten
Mfr
JAE Electronics
Series
FI-XP
Package
Bulk
Product Status
Obsolete
Connector Type
Receptacle
Contact Type
Non-Gendered
Style
Board to Cable/Wire
Number of Positions
30
Number of Positions Loaded
All
Pitch - Mating
0.039" (1.00mm)
Number of Rows
1
Row Spacing - Mating
-
Mounting Type
Board Edge, Cutout; Bottom Mount, Surface Mount, Right Angle
Termination
Solder
Fastening Type
Friction Lock
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
12.0µin (0.30µm)
Insulation Color
Beige
Insulation Height
-
Contact Length - Post
-
Operating Temperature
-
Material Flammability Rating
UL94 V-0
Contact Finish - Post
Tin
Mated Stacking Heights
-
Ingress Protection
-
Features
Grounding Pins, Shielded, Solder Retention
Current Rating (Amps)
-
Voltage Rating
-
Applications
-
Insulation Material
Plastic
Contact Shape
-
Contact Material
Copper Alloy
Contact Finish Thickness - Post
-
Base Product Number
FI-XPB30
Umweltverträgliche Exportklassifikationen
Moisture Sensitivity Level (MSL)
1 (Unlimited)
ECCN
EAR99
HTSUS
8536.69.4040
Andere Namen
FIXPB30SLHF10
670-2205
-FI-XPB30SL-HF10
Kategorie
/Product Index/Connectors, Interconnects/Rectangular Connectors/Headers, Receptacles, Female Sockets/JAE Electronics FI-XPB30SL-HF10
Dokumente und Medien
PCN Obsolescence/ EOL
1(Multiple Devices 17/Apr/2015)
Product Drawings
()
Menge Preis
-
Stellvertreter
-