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ChinaSEAMP-30-02.0-L-10-GP
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
SEAMP-30-02.0-L-10-GP
BESCHREIBUNG
CONN HD ARRAY M 300POS PRESS-FIT
DETAILIERTE BESCHREIBUNG
300 Position Connector High Density Array, Male Through Hole Gold
HERSTELLER
Samtec Inc.
STANDARD LEADTIME
5 Weeks
EDACAD-MODELL
STANDARDPAKET
9
Lagerbestände
Technische Daten
Mfr
Samtec Inc.
Series
SEARAY™ SEAMP
Package
Tube
Product Status
Active
Connector Type
High Density Array, Male
Number of Positions
300
Pitch
0.050" (1.27mm)
Number of Rows
10
Mounting Type
Through Hole
Features
Board Guide
Contact Finish
Gold
Contact Finish Thickness
10.0µin (0.25µm)
Mated Stacking Heights
7mm, 8mm, 8.5mm
Height Above Board
0.181" (4.60mm)
Base Product Number
SEAMP-30
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
ECCN
EAR99
HTSUS
8536.69.4040
Andere Namen
-
Kategorie
/Product Index/Connectors, Interconnects/Rectangular Connectors/Arrays, Edge Type, Mezzanine (Board to Board)/Samtec Inc. SEAMP-30-02.0-L-10-GP
Dokumente und Medien
Datasheets
1(SEAMP Series Datasheet)
Menge Preis
QUANTITÄT: 1
Einzelpreis: $31.41
Verpackung: Tube
MinMultiplikator: 1
Verpackung: Tube
MinMultiplikator: 1
Stellvertreter
-