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Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
2-1571550-7
BESCHREIBUNG
CONN IC DIP SOCKET 22POS GOLD
DETAILIERTE BESCHREIBUNG
22 (2 x 11) Pos DIP, 0.4" (10.16mm) Row Spacing Socket Gold Through Hole
HERSTELLER
TE Connectivity AMP Connectors
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
735
Lagerbestände
Technische Daten
Mfr
TE Connectivity AMP Connectors
Series
500
Package
Tube
Product Status
Active
Type
DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid)
22 (2 x 11)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
25.0µin (0.63µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
25.0µin (0.63µm)
Contact Material - Post
Beryllium Copper
Housing Material
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature
-55°C ~ 125°C
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
UL94 V-0
Contact Resistance
10mOhm
Base Product Number
1571550
Umweltverträgliche Exportklassifikationen
RoHS Status
RoHS Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
Vendor Undefined
ECCN
EAR99
HTSUS
8536.69.4040
Andere Namen
-
Kategorie
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/TE Connectivity AMP Connectors 2-1571550-7
Dokumente und Medien
Datasheets
1(1571550)
Environmental Information
1(2-1571550-7 Statement of Compliance)
HTML Datasheet
1(1571550)
3D Drawings
1(2-1571550-7.pdf)
Menge Preis
-
Stellvertreter
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