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ChinaPA0187
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
PA0187
BESCHREIBUNG
TO-263-9 DDPAK/D2PAK TO DIP-18 S
DETAILIERTE BESCHREIBUNG
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
Lagerbestände
Technische Daten
Mfr
Chip Quik Inc.
Series
Proto-Advantage
Package
Bulk
Product Status
Active
Proto Board Type
SMD to DIP
Package Accepted
TO-263 (DDPAK/D2PAK)
Number of Positions
9
Pitch
0.038" (0.97mm)
Board Thickness
0.062" (1.57mm) 1/16"
Material
FR4 Epoxy Glass
Size / Dimension
0.700" x 1.000" (17.78mm x 25.40mm)
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Andere Namen
-
Kategorie
/Product Index/Prototyping, Fabrication Products/Adapter, Breakout Boards/Chip Quik Inc. PA0187
Dokumente und Medien
Datasheets
()
Video File
1(Surface Mount Pin Soldering of SMT to DIP Adapters)
Featured Product
()
HTML Datasheet
()
Menge Preis
QUANTITÄT: 1
Einzelpreis: $5.79
Verpackung: Bulk
MinMultiplikator: 1
Verpackung: Bulk
MinMultiplikator: 1
Stellvertreter
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