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ChinaSMD291SNL50T6
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
SMD291SNL50T6
BESCHREIBUNG
SOLDER PASTE IN JAR 50G (T6) SAC
DETAILIERTE BESCHREIBUNG
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 1.76 oz (50g)
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
4 Weeks
EDACAD-MODELL
STANDARDPAKET
1
Lagerbestände
Technische Daten
Mfr
Chip Quik Inc.
Series
SMD
Package
Bulk
Product Status
Active
Type
Solder Paste
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
-
Melting Point
422 ~ 428°F (217 ~ 220°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
6
Process
Lead Free
Form
Jar, 1.76 oz (50g)
Shelf Life
6 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)
Base Product Number
SMD291
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8311.90.0000
Andere Namen
-
Kategorie
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. SMD291SNL50T6
Dokumente und Medien
Datasheets
1(SMD291SNL50T6)
MSDS Material Safety Datasheet
1(Lead Free Solder Paste SDS)
HTML Datasheet
1(SMD291SNL50T6)
Menge Preis
QUANTITÄT: 1
Einzelpreis: $99.95
Verpackung: Bulk
MinMultiplikator: 1
Verpackung: Bulk
MinMultiplikator: 1
Stellvertreter
-