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ChinaTS391SNL10
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
TS391SNL10
BESCHREIBUNG
THERMALLY STABLE SOLDER PASTE NO
DETAILIERTE BESCHREIBUNG
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 1.23 oz (35g), 10cc
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
3 Weeks
EDACAD-MODELL
STANDARDPAKET
Lagerbestände
Technische Daten
Mfr
Chip Quik Inc.
Series
-
Package
Bulk
Product Status
Active
Type
Solder Paste
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
-
Melting Point
423 ~ 428°F (217 ~ 220°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
4
Process
Lead Free
Form
Syringe, 1.23 oz (35g), 10cc
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
68°F ~ 77°F (20°C ~ 25°C)
Shipping Info
-
Base Product Number
TS391S
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
3810.10.0000
Andere Namen
-
Kategorie
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. TS391SNL10
Dokumente und Medien
Datasheets
1(TS391SNL10)
MSDS Material Safety Datasheet
1(TS391SNL10 SDS)
Featured Product
1(Thermally Stable Solder Paste)
HTML Datasheet
1(TS391SNL10)
Menge Preis
QUANTITÄT: 1
Einzelpreis: $31.95
Verpackung: Bulk
MinMultiplikator: 1
Verpackung: Bulk
MinMultiplikator: 1
Stellvertreter
-