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ChinaHSB22-606010
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
HSB22-606010
BESCHREIBUNG
HEAT SINK, BGA, 60 X 60 X 10 MM
DETAILIERTE BESCHREIBUNG
Heat Sink BGA Aluminum 9.8W @ 75°C Top Mount
HERSTELLER
CUI Devices
STANDARD LEADTIME
16 Weeks
EDACAD-MODELL
STANDARDPAKET
500
Lagerbestände
Technische Daten
Mfr
CUI Devices
Series
HSB
Package
Box
Product Status
Active
Type
Top Mount
Package Cooled
BGA
Attachment Method
Adhesive
Shape
Square, Pin Fins
Length
2.362" (60.00mm)
Width
2.362" (60.00mm)
Diameter
-
Fin Height
0.394" (10.00mm)
Power Dissipation @ Temperature Rise
9.8W @ 75°C
Thermal Resistance @ Forced Air Flow
2.60°C/W @ 200 LFM
Thermal Resistance @ Natural
7.62°C/W
Material
Aluminum
Material Finish
Black Anodized
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8473.30.5100
Andere Namen
-
Kategorie
/Product Index/Fans, Thermal Management/Thermal/Heat Sinks/CUI Devices HSB22-606010
Dokumente und Medien
Datasheets
1(HSB22-606010 Datasheet)
Other Related Documents
1(How to Select a Heat Sink)
Environmental Information
1(HSB22-606010 RoHS/REACH)
Design Resources
1(Heat Sink Calculator)
Featured Product
1(Thermal Management Solutions)
Menge Preis
QUANTITÄT: 500
Einzelpreis: $2.37248
Verpackung: Box
MinMultiplikator: 500
Verpackung: Box
MinMultiplikator: 500
Stellvertreter
-