English
Spain
Rusia
Italy
ChinaSMD291SNL500T5
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
SMD291SNL500T5
BESCHREIBUNG
SOLDER PASTE SAC305 500G T5
DETAILIERTE BESCHREIBUNG
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
2 Weeks
EDACAD-MODELL
STANDARDPAKET
Lagerbestände
Technische Daten
Mfr
Chip Quik Inc.
Series
-
Package
Jar
Product Status
Active
Type
Solder Paste
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
-
Melting Point
423 ~ 428°F (217 ~ 220°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
5
Process
Lead Free
Form
Jar, 17.64 oz (500g)
Shelf Life
6 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)
Shipping Info
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Base Product Number
SMD291
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
3810.10.0000
Andere Namen
-
Kategorie
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. SMD291SNL500T5
Dokumente und Medien
Datasheets
1(SMD291SNL500T5)
MSDS Material Safety Datasheet
1(SMD291SN)
HTML Datasheet
1(SMD291SNL500T5)
Menge Preis
QUANTITÄT: 1
Einzelpreis: $198.95
Verpackung: Jar
MinMultiplikator: 1
Verpackung: Jar
MinMultiplikator: 1
Stellvertreter
-