English
Spain
Rusia
Italy
ChinaSMDSW.031 8OZ
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
SMDSW.031 8OZ
BESCHREIBUNG
SOLDER WIRE 63/37 TIN/LEAD NO-CL
DETAILIERTE BESCHREIBUNG
Leaded No-Clean, Water Soluble Wire Solder Sn63Pb37 (63/37) 20 AWG, 22 SWG Spool, 8 oz (227g), 1/2 lb
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
4 Weeks
EDACAD-MODELL
STANDARDPAKET
1
Lagerbestände
Technische Daten
Mfr
Chip Quik Inc.
Series
-
Package
Bulk
Product Status
Active
Type
Wire Solder
Composition
Sn63Pb37 (63/37)
Diameter
0.031" (0.79mm)
Melting Point
361°F (183°C)
Flux Type
No-Clean, Water Soluble
Wire Gauge
20 AWG, 22 SWG
Process
Leaded
Form
Spool, 8 oz (227g), 1/2 lb
Shelf Life
-
Shelf Life Start
-
Storage/Refrigeration Temperature
-
allaboutcomponents.com Storage
-
Shipping Info
-
Base Product Number
SMDSW
Umweltverträgliche Exportklassifikationen
RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Affected
ECCN
EAR99
HTSUS
8311.30.3000
California Prop 65
Andere Namen
SMDSW.031 8OZ-ND
SMDSW.0318OZ
Kategorie
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. SMDSW.031 8OZ
Dokumente und Medien
Datasheets
1(SMDSW.031 8OZ Datasheet)
MSDS Material Safety Datasheet
1(SMDSW.031 8OZ SDS)
HTML Datasheet
1(SMDSW.031 8OZ Datasheet)
Menge Preis
QUANTITÄT: 1
Einzelpreis: $24.4
Verpackung: Bulk
MinMultiplikator: 1
Verpackung: Bulk
MinMultiplikator: 1
Stellvertreter
-