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ChinaAPF19-19-06CB
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
APF19-19-06CB
BESCHREIBUNG
HEATSINK LOW-PROFILE FORGED
DETAILIERTE BESCHREIBUNG
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
HERSTELLER
CTS Thermal Management Products
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
300
Lagerbestände
Technische Daten
Mfr
CTS Thermal Management Products
Series
APF
Package
Box
Product Status
Active
Type
Top Mount
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Not Included)
Shape
Square, Fins
Length
0.748" (19.00mm)
Width
0.748" (19.00mm)
Diameter
-
Fin Height
0.250" (6.35mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
7.10°C/W @ 200 LFM
Thermal Resistance @ Natural
-
Material
Aluminum
Material Finish
Black Anodized
Base Product Number
APF19
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8473.30.5100
California Prop 65
Andere Namen
APF191906CB
294-1145
Kategorie
/Product Index/Fans, Thermal Management/Thermal/Heat Sinks/CTS Thermal Management Products APF19-19-06CB
Dokumente und Medien
Datasheets
()
Environmental Information
()
HTML Datasheet
1(AER, APF Series Datasheet~)
Product Drawings
1(APF-19-19-06CB Series)
Menge Preis
-
Stellvertreter
-