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Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
HIC-764-SST
BESCHREIBUNG
CONN IC DIP SOCKET 64POS GOLD
DETAILIERTE BESCHREIBUNG
64 (2 x 32) Pos DIP, 0.75" (19.05mm) Row Spacing Socket Gold Through Hole
HERSTELLER
Samtec Inc.
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
Lagerbestände
Technische Daten
Mfr
Samtec Inc.
Series
HIC
Package
Tube
Product Status
Obsolete
Type
DIP, 0.75" (19.05mm) Row Spacing
Number of Positions or Pins (Grid)
64 (2 x 32)
Pitch - Mating
0.070" (1.78mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
10.0µin (0.25µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Open Frame
Termination
Solder
Pitch - Post
0.070" (1.78mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
200.0µin (5.08µm)
Contact Material - Post
Brass
Housing Material
Polyester, Glass Filled
Operating Temperature
-
Termination Post Length
0.118" (3.00mm)
Material Flammability Rating
UL94 V-0
Contact Resistance
-
Base Product Number
HIC-764
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
California Prop 65
Andere Namen
-
Kategorie
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Samtec Inc. HIC-764-SST
Dokumente und Medien
PCN Obsolescence/ EOL
1(DK OBS NOTICE)
HTML Datasheet
1(HIC-764-SST Drawing)
Product Drawings
1(HIC-764-SST Drawing)
Menge Preis
-
Stellvertreter
-