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TEILNUMMER DES HERSTELLERS
ESQT-115-02-M-D-669
BESCHREIBUNG
CONN SOCKET 30POS 0.079 GOLD PCB
DETAILIERTE BESCHREIBUNG
30 Position Elevated Socket Connector 0.079" (2.00mm) Through Hole Gold
HERSTELLER
Samtec Inc.
STANDARD LEADTIME
EDACAD-MODELL
ESQT-115-02-M-D-669 Models
STANDARDPAKET
Lagerbestände
Technische Daten
Mfr
Samtec Inc.
Series
ESQT
Package
Bulk
Product Status
Active
Connector Type
Elevated Socket
Contact Type
Forked
Style
Board to Board or Cable
Number of Positions
30
Number of Positions Loaded
All
Pitch - Mating
0.079" (2.00mm)
Number of Rows
2
Row Spacing - Mating
0.079" (2.00mm)
Mounting Type
Through Hole
Termination
Solder
Fastening Type
Push-Pull
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
20.0µin (0.51µm)
Insulation Color
Black
Insulation Height
0.669" (17.00mm)
Contact Length - Post
0.181" (4.60mm)
Operating Temperature
-55°C ~ 125°C
Material Flammability Rating
UL94 V-0
Contact Finish - Post
Tin
Mated Stacking Heights
-
Ingress Protection
-
Features
-
Current Rating (Amps)
4.5A per Contact
Voltage Rating
-
Applications
-
Insulation Material
Liquid Crystal Polymer (LCP)
Contact Shape
Square
Contact Material
Phosphor Bronze
Contact Finish Thickness - Post
-
Base Product Number
ESQT-115
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
ECCN
EAR99
HTSUS
8536.69.4040
California Prop 65
Andere Namen
-
Kategorie
/Product Index/Connectors, Interconnects/Rectangular Connectors/Headers, Receptacles, Female Sockets/Samtec Inc. ESQT-115-02-M-D-669
Dokumente und Medien
CAD Models
1(ESQT-115-02-M-D-669 Models)
EDA Models
1(ESQT-115-02-M-D-669 Models)
Menge Preis
-
Stellvertreter
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