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TEILNUMMER DES HERSTELLERS
NC191LTA50T5
BESCHREIBUNG
SMOOTH FLOW LOW TEMP SOLDER PAST
DETAILIERTE BESCHREIBUNG
No-Clean Solder Paste Bi57Sn42Ag1 (57/42/1) Jar, 1.76 oz (50g)
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
4 Weeks
EDACAD-MODELL
STANDARDPAKET
1
Lagerbestände
Technische Daten
Mfr
Chip Quik Inc.
Series
Smooth Flow™
Package
Bulk
Product Status
Active
Type
Solder Paste
Composition
Bi57Sn42Ag1 (57/42/1)
Diameter
-
Melting Point
279°F (137°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
5
Process
-
Form
Jar, 1.76 oz (50g)
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)
Base Product Number
NC191
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
3810.10.0000
Andere Namen
-
Kategorie
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. NC191LTA50T5
Dokumente und Medien
HTML Datasheet
1(NC191LTA50T5 Datasheet)
Product Drawings
1(NC191LTA50T5 Datasheet)
Menge Preis
QUANTITÄT: 1
Einzelpreis: $27.95
Verpackung: Bulk
MinMultiplikator: 1
Verpackung: Bulk
MinMultiplikator: 1
Stellvertreter
-