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China822-AG11D
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
822-AG11D
BESCHREIBUNG
CONN IC DIP SOCKET 22POS GOLD
DETAILIERTE BESCHREIBUNG
22 (2 x 11) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
HERSTELLER
TE Connectivity AMP Connectors
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
22
Lagerbestände
Technische Daten
Mfr
TE Connectivity AMP Connectors
Series
800
Package
Tube
Product Status
Obsolete
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
22 (2 x 11)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
25.0µin (0.63µm)
Contact Material - Mating
Copper Alloy
Mounting Type
Through Hole
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin-Lead
Contact Finish Thickness - Post
80.0µin (2.03µm)
Contact Material - Post
Copper Alloy
Housing Material
Polyester
Operating Temperature
-55°C ~ 105°C
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
UL94 V-0
Contact Resistance
10mOhm
Base Product Number
822
Umweltverträgliche Exportklassifikationen
RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
Vendor Undefined
ECCN
EAR99
HTSUS
8536.69.4040
Andere Namen
A144444
822-AG11D-ND
7-1437537-8
Kategorie
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/TE Connectivity AMP Connectors 822-AG11D
Dokumente und Medien
PCN Obsolescence/ EOL
1(DK OBS NOTICE)
Product Drawings
1(1437539-2 Drawing)
Menge Preis
-
Stellvertreter
-