Übersicht der Teilenummer

TEILNUMMER DES HERSTELLERS
PA0103-S
BESCHREIBUNG
STENCIL LGA-16 .5MM
DETAILIERTE BESCHREIBUNG
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
2 Weeks
EDACAD-MODELL
STANDARDPAKET
1

Technische Daten

Mfr
Chip Quik Inc.
Series
Proto-Advantage PA
Package
Bulk
Product Status
Active
Type
LGA
Number of Positions
16
Pitch
0.020" (0.50mm)
Outer Dimension
1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension
0.118" L x 0.118" W (3.00mm x 3.00mm)
Thermal Center Pad
-
Material
Stainless Steel
Thickness
0.0040" (0.102mm)

Umweltverträgliche Exportklassifikationen

RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8515.19.0000

Andere Namen

-

Kategorie

/Product Index/Soldering, Desoldering, Rework Products/Solder Stencils, Templates/Chip Quik Inc. PA0103-S

Dokumente und Medien

Datasheets
()
Video File
1(Prototyping with Solder Stencils - Another Teaching Moment | allaboutcomponents.com Electronics)
Featured Product
1(Adapters, Breadboards, and Accessories)
HTML Datasheet
()

Menge Preis

QUANTITÄT: 1
Einzelpreis: $11.59
Verpackung: Bulk
MinMultiplikator: 1

Stellvertreter

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