Übersicht der Teilenummer

TEILNUMMER DES HERSTELLERS
TXBF-019-025B
BESCHREIBUNG
THERMAL LINK PRESSON TO-18
DETAILIERTE BESCHREIBUNG
Heat Sink TO-18 Beryllium Copper Top Mount
HERSTELLER
CTS Thermal Management Products
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
250

Technische Daten

Mfr
CTS Thermal Management Products
Series
Fan Top
Product Status
Obsolete
Type
Top Mount
Package Cooled
TO-18
Attachment Method
Press Fit
Shape
Cylindrical
Length
-
Width
-
Diameter
0.500" (12.70mm) OD
Fin Height
0.250" (6.35mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
-
Thermal Resistance @ Natural
150.00°C/W
Material
Beryllium Copper
Material Finish
Black Cadmium

Umweltverträgliche Exportklassifikationen

RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8473.30.5100

Andere Namen

-

Kategorie

/Product Index/Fans, Thermal Management/Thermal/Heat Sinks/CTS Thermal Management Products TXBF-019-025B

Dokumente und Medien

Datasheets
1(TX Series Heatsinks, Thermal Links)
HTML Datasheet
1(TX Series Heatsinks, Thermal Links)
Product Drawings
1(TXBF Series)

Menge Preis

-

Stellvertreter

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