English
Spain
Rusia
Italy
ChinaNC191LTA35T5
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
NC191LTA35T5
BESCHREIBUNG
SMOOTH FLOW LOW TEMP SOLDER PAST
DETAILIERTE BESCHREIBUNG
No-Clean Solder Paste Bi57Sn42Ag1 (57/42/1) Syringe, 1.23 oz (35g), 10cc
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
4 Weeks
EDACAD-MODELL
STANDARDPAKET
1
Lagerbestände
Technische Daten
Mfr
Chip Quik Inc.
Series
Smooth Flow™
Package
Bulk
Product Status
Active
Type
Solder Paste
Composition
Bi57Sn42Ag1 (57/42/1)
Diameter
-
Melting Point
279°F (137°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
5
Process
-
Form
Syringe, 1.23 oz (35g), 10cc
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)
Base Product Number
NC191
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
3810.10.0000
Andere Namen
-
Kategorie
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. NC191LTA35T5
Dokumente und Medien
HTML Datasheet
1(NC191LTA35T5 Datasheet)
Product Drawings
1(NC191LTA35T5 Datasheet)
Menge Preis
QUANTITÄT: 1
Einzelpreis: $23.95
Verpackung: Bulk
MinMultiplikator: 1
Verpackung: Bulk
MinMultiplikator: 1
Stellvertreter
-