Übersicht der Teilenummer

TEILNUMMER DES HERSTELLERS
832-AG10D-ES
BESCHREIBUNG
CONN IC DIP SOCKET 32POS GOLD
DETAILIERTE BESCHREIBUNG
32 (2 x 16) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole
HERSTELLER
TE Connectivity AMP Connectors
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
375

Technische Daten

Mfr
TE Connectivity AMP Connectors
Series
800
Package
Tube
Product Status
Obsolete
Type
DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
32 (2 x 16)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
25.0µin (0.63µm)
Contact Material - Mating
Copper Alloy
Mounting Type
Through Hole
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
-
Contact Finish Thickness - Post
-
Contact Material - Post
-
Housing Material
Polyester
Operating Temperature
-55°C ~ 105°C
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
3 A
Contact Resistance
10mOhm
Base Product Number
832

Umweltverträgliche Exportklassifikationen

RoHS Status
RoHS Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Affected
ECCN
EAR99
HTSUS
8536.69.4040

Andere Namen

1437540-1-ND
1437540-1

Kategorie

/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/TE Connectivity AMP Connectors 832-AG10D-ES

Dokumente und Medien

UNKNOWN TYPE
1(DK OBS NOTICE)
Environmental Information
1(1437540-1 Statement of Compliance)
3D Drawings
1(1437540-1.pdf)
Product Drawings
1(800 Series Drawing)

Menge Preis

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Stellvertreter

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