Übersicht der Teilenummer

TEILNUMMER DES HERSTELLERS
733024
BESCHREIBUNG
96SC C400 3C 0.56MM 0.25KG.022"
DETAILIERTE BESCHREIBUNG
Lead Free No-Clean Wire Solder Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) 23 AWG, 24 SWG Spool, 8.8 oz (250g)
HERSTELLER
Harimatec Inc.
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET

Technische Daten

Mfr
Harimatec Inc.
Series
C400
Package
Bulk
Product Status
Obsolete
Type
Wire Solder
Composition
Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Diameter
0.022" (0.56mm)
Melting Point
423°F (217°C)
Flux Type
No-Clean
Wire Gauge
23 AWG, 24 SWG
Process
Lead Free
Form
Spool, 8.8 oz (250g)
Shelf Life
-
Shelf Life Start
-
Storage/Refrigeration Temperature
59°F ~ 86°F (15°C ~ 30°C)
Shipping Info
-

Umweltverträgliche Exportklassifikationen

RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
Not Applicable
ECCN
EAR99
HTSUS
8311.30.6000

Andere Namen

-

Kategorie

/Product Index/Soldering, Desoldering, Rework Products/Solder/Harimatec Inc. 733024

Dokumente und Medien

Datasheets
()
PCN Obsolescence/ EOL
1(Closing of Sale of Henkel’s Solder Material Business 06/MAY/2022)
PCN Packaging
1(Henkel/Berquist Revised Brands 10/May/2016)
HTML Datasheet
1(Properties of Solders)

Menge Preis

-

Stellvertreter

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