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Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
SEAMP-30-02.0-S-06
BESCHREIBUNG
CONN HD ARRAY M 180POS PRESS-FIT
DETAILIERTE BESCHREIBUNG
180 Position Connector High Density Array, Male Through Hole Gold
HERSTELLER
Samtec Inc.
STANDARD LEADTIME
5 Weeks
EDACAD-MODELL
SEAMP-30-02.0-S-06 Models
STANDARDPAKET
44
Lagerbestände
Technische Daten
Mfr
Samtec Inc.
Series
SEARAY™ SEAMP
Package
Tray
Product Status
Active
Connector Type
High Density Array, Male
Number of Positions
180
Pitch
0.050" (1.27mm)
Number of Rows
6
Mounting Type
Through Hole
Features
-
Contact Finish
Gold
Contact Finish Thickness
30.0µin (0.76µm)
Mated Stacking Heights
7mm, 8mm, 8.5mm
Height Above Board
0.181" (4.60mm)
Base Product Number
SEAMP-30
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
ECCN
EAR99
HTSUS
8536.69.4040
Andere Namen
-
Kategorie
/Product Index/Connectors, Interconnects/Rectangular Connectors/Arrays, Edge Type, Mezzanine (Board to Board)/Samtec Inc. SEAMP-30-02.0-S-06
Dokumente und Medien
Datasheets
1(SEAMP Series Datasheet)
Featured Product
1(EV Charging Solutions)
CAD Models
1(SEAMP-30-02.0-S-06 Models)
Menge Preis
QUANTITÄT: 44
Einzelpreis: $18.80114
Verpackung: Tray
MinMultiplikator: 44
Verpackung: Tray
MinMultiplikator: 44
Stellvertreter
-