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ChinaBDN17-3CB/A01
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
BDN17-3CB/A01
BESCHREIBUNG
HEATSINK CPU W/ADHESIVE 1.71"SQ
DETAILIERTE BESCHREIBUNG
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
HERSTELLER
CTS Thermal Management Products
STANDARD LEADTIME
14 Weeks
EDACAD-MODELL
STANDARDPAKET
1,000
Lagerbestände
Technische Daten
Mfr
CTS Thermal Management Products
Series
BDN
Package
Tray
Product Status
Active
Type
Top Mount
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Included)
Shape
Square, Pin Fins
Length
1.710" (43.43mm)
Width
1.710" (43.43mm)
Diameter
-
Fin Height
0.355" (9.02mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
3.80°C/W @ 400 LFM
Thermal Resistance @ Natural
11.50°C/W
Material
Aluminum
Material Finish
Black Anodized
Shelf Life
24 Months
Base Product Number
BDN17
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8473.30.5100
California Prop 65
Andere Namen
BDN173CB/A01
BDN173CBA01
294-1111
Kategorie
/Product Index/Fans, Thermal Management/Thermal/Heat Sinks/CTS Thermal Management Products BDN17-3CB/A01
Dokumente und Medien
Datasheets
()
Environmental Information
()
HTML Datasheet
1(BDN Series, Adhesive Heat Sink)
Product Drawings
1(BDN17-3CB^A01)
Menge Preis
QUANTITÄT: 1000
Einzelpreis: $3.28381
Verpackung: Tray
MinMultiplikator: 1000
Verpackung: Tray
MinMultiplikator: 1000
Stellvertreter
-