Übersicht der Teilenummer

TEILNUMMER DES HERSTELLERS
PA0060
BESCHREIBUNG
QFN-16-THIN TO DIP-16 SMT ADAPTE
DETAILIERTE BESCHREIBUNG
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
4 Weeks
EDACAD-MODELL
STANDARDPAKET

Technische Daten

Mfr
Chip Quik Inc.
Series
Proto-Advantage
Package
Bulk
Product Status
Active
Proto Board Type
SMD to DIP
Package Accepted
QFN THIN
Number of Positions
16
Pitch
0.026" (0.65mm)
Board Thickness
0.062" (1.57mm) 1/16"
Material
FR4 Epoxy Glass
Size / Dimension
0.700" x 0.800" (17.78mm x 20.32mm)

Umweltverträgliche Exportklassifikationen

RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040

Andere Namen

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Kategorie

/Product Index/Prototyping, Fabrication Products/Adapter, Breakout Boards/Chip Quik Inc. PA0060

Dokumente und Medien

Datasheets
()
Video File
1(Surface Mount Pin Soldering of SMT to DIP Adapters)
Featured Product
()
HTML Datasheet
()

Menge Preis

QUANTITÄT: 1
Einzelpreis: $4.79
Verpackung: Bulk
MinMultiplikator: 1

Stellvertreter

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