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Part Number Overview
Manufacturer Part Number
WS991LT500T4
Description
SOLDER PASTE THERMALLY STABLE WS
Detailed Description
Lead Free Water Soluble Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 17.64 oz (500g)
Manufacturer
Chip Quik Inc.
Standard LeadTime
4 Weeks
Edacad Model
Standard Package
1
Supplier Stocks
Technical specifications
Mfr
Chip Quik Inc.
Series
CHIPQUIK®
Package
Bulk
Product Status
Active
Type
Solder Paste
Composition
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter
-
Melting Point
281°F (138°C)
Flux Type
Water Soluble
Wire Gauge
-
Mesh Type
4
Process
Lead Free
Form
Jar, 17.64 oz (500g)
Shelf Life
6 Months
Shelf Life Start
Date of Manufacture
Base Product Number
WS991
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
3810.10.0000
Other Names
-
Category
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. WS991LT500T4
Documents & Media
Datasheets
1(WS991LT500T4 Datasheet)
HTML Datasheet
1(WS991LT500T4 Datasheet)
Quantity Price
Quantity: 100
Unit Price: $73.4714
Packaging: Bulk
MinMultiplier: 1
Packaging: Bulk
MinMultiplier: 1
Quantity: 10
Unit Price: $83.967
Packaging: Bulk
MinMultiplier: 1
Packaging: Bulk
MinMultiplier: 1
Quantity: 1
Unit Price: $97.09
Packaging: Bulk
MinMultiplier: 1
Packaging: Bulk
MinMultiplier: 1
Substitutes
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