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Part Number Overview
Manufacturer Part Number
MMF006630
Description
1240-FPA SILVER SOLDER PASTE --
Detailed Description
Lead Free Solder Paste Ag40Cu30Zn28Ni2 (40/30/28/2) Jar, 1 oz (28g)
Manufacturer
Micro-Measurements (Division of Vishay Precision Group)
Standard LeadTime
18 Weeks
Edacad Model
Standard Package
1
Supplier Stocks
Technical specifications
Mfr
Micro-Measurements (Division of Vishay Precision Group)
Series
-
Package
Jar
Product Status
Active
Type
Solder Paste
Composition
Ag40Cu30Zn28Ni2 (40/30/28/2)
Diameter
-
Melting Point
1220 ~ 1435°F (660 ~ 780°C)
Flux Type
-
Wire Gauge
-
Mesh Type
-
Process
Lead Free
Form
Jar, 1 oz (28g)
Shelf Life
9 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
41°F ~ 77°F (5°C ~ 25°C)
Environmental & Export Classifications
RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
ECCN
EAR99
HTSUS
3810.10.0000
Other Names
-
Category
/Product Index/Soldering, Desoldering, Rework Products/Solder/Micro-Measurements (Division of Vishay Precision Group) MMF006630
Documents & Media
Datasheets
1(Solders, Accessories Datasheet)
MSDS Material Safety Datasheet
1(1240 FPA Silver Solder)
HTML Datasheet
1(Solders, Accessories Datasheet)
Quantity Price
Quantity: 1
Unit Price: $190.9
Packaging: Jar
MinMultiplier: 1
Packaging: Jar
MinMultiplier: 1
Substitutes
-