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Part Number Overview
Manufacturer Part Number
TC3-3.5G
Description
HEAT SINK THERMAL COMPOUND
Detailed Description
Thermal Silicone Compound 3.5 gram Syringe
Manufacturer
Chip Quik Inc.
Standard LeadTime
4 Weeks
Edacad Model
Standard Package
1
Supplier Stocks
Technical specifications
Mfr
Chip Quik Inc.
Series
CHIPQUIK®
Package
Bulk
Product Status
Active
Type
Silicone Compound
Size / Dimension
3.5 gram Syringe
Usable Temperature Range
-40°F ~ 302°F (-40°C ~ 150°C)
Color
Gray
Thermal Conductivity
8.50W/m-K
Features
-
Shelf Life
60 Months
Storage/Refrigeration Temperature
37°F ~ 77°F (3°C ~ 25°C)
Material Flammability Rating
-
Shelf Life Start
Date of Manufacture
Shipping Info
-
allaboutcomponents.com Storage
-
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
3810.10.0000
Other Names
-
Category
/Product Index/Fans, Thermal Management/Thermal/Adhesives, Epoxies, Greases, Pastes/Chip Quik Inc. TC3-3.5G
Documents & Media
Datasheets
1(TC3-3.5G Datasheet)
Featured Product
1(TC3 Ultra Max™ Thermal Compound)
HTML Datasheet
1(TC3-3.5G Datasheet)
Quantity Price
Quantity: 1
Unit Price: $14.95
Packaging: Bulk
MinMultiplier: 1
Packaging: Bulk
MinMultiplier: 1
Substitutes
-