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Part Number Overview
Manufacturer Part Number
IPC0192-S
Description
QFN-36/LFCSP-36 (5 CENTER PADS)
Detailed Description
Manufacturer
Chip Quik Inc.
Standard LeadTime
2 Weeks
Edacad Model
Standard Package
Supplier Stocks
Technical specifications
Mfr
Chip Quik Inc.
Series
Proto-Advantage IPC
Package
Bulk
Product Status
Active
Type
QFN/LFCSP
Number of Positions
36
Pitch
0.035" (0.90mm)
Outer Dimension
1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension
0.433" L x 0.354" W (11.00mm x 9.00mm)
Thermal Center Pad
0.122" L x 0.087" W (3.10mm x 2.20mm)
Material
Stainless Steel
Thickness
0.0040" (0.102mm)
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8515.19.0000
Other Names
-
Category
/Product Index/Soldering, Desoldering, Rework Products/Solder Stencils, Templates/Chip Quik Inc. IPC0192-S
Documents & Media
Datasheets
()
Video File
1(Prototyping with Solder Stencils - Another Teaching Moment | allaboutcomponents.com Electronics)
HTML Datasheet
1(IPC0192-S)
Quantity Price
Quantity: 1
Unit Price: $12.93
Packaging: Bulk
MinMultiplier: 1
Packaging: Bulk
MinMultiplier: 1
Substitutes
-