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Part Number Overview
Manufacturer Part Number
233-PGM18039-51
Description
CONN SOCKET PGA GOLD
Detailed Description
Pos PGA Socket Gold Through Hole
Manufacturer
Aries Electronics
Standard LeadTime
Edacad Model
Standard Package
Supplier Stocks
Technical specifications
Mfr
Aries Electronics
Series
PGM
Package
Bulk
Product Status
Active
Type
PGA
Number of Positions or Pins (Grid)
-
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
10.0µin (0.25µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
-
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
10.0µin (0.25µm)
Contact Material - Post
Brass
Housing Material
Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature
-55°C ~ 125°C
Termination Post Length
0.165" (4.19mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
3 A
Contact Resistance
-
Base Product Number
233-PGM
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Other Names
-
Category
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Aries Electronics 233-PGM18039-51
Documents & Media
Datasheets
1(Pin Grid Array Socket/Header)
Environmental Information
()
HTML Datasheet
1(Pin Grid Array Socket/Header)
Quantity Price
-
Substitutes
-