China
Spain
Rusia
Italy
GermanyBGA0023-S
Part Number Overview
Manufacturer Part Number
BGA0023-S
Description
BGA-100 (0.4 MM PITCH, 10 X 10 G
Detailed Description
Manufacturer
Chip Quik Inc.
Standard LeadTime
3 Weeks
Edacad Model
Standard Package
Supplier Stocks
Technical specifications
Mfr
Chip Quik Inc.
Series
Proto-Advantage BGA
Package
Bulk
Product Status
Active
Type
BGA
Number of Positions
100
Pitch
0.016" (0.40mm)
Outer Dimension
1.950" L x 1.350" W (49.53mm x 34.29mm)
Inner Dimension
-
Thermal Center Pad
-
Material
Stainless Steel
Thickness
0.0040" (0.102mm)
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8534.00.0040
Other Names
-
Category
/Product Index/Soldering, Desoldering, Rework Products/Solder Stencils, Templates/Chip Quik Inc. BGA0023-S
Documents & Media
Datasheets
1(BGA0023-S)
Video File
1(Prototyping with Solder Stencils - Another Teaching Moment | allaboutcomponents.com Electronics)
HTML Datasheet
1(BGA0023-S)
Quantity Price
Quantity: 1
Unit Price: $20.99
Packaging: Bulk
MinMultiplier: 1
Packaging: Bulk
MinMultiplier: 1
Substitutes
-