Part Number Overview

Manufacturer Part Number
HSB02-101007
Description
HEAT SINK, BGA, 10 X 10 X 7 MM
Detailed Description
Heat Sink BGA Aluminum Alloy 2.0W @ 75°C Top Mount
Manufacturer
CUI Devices
Standard LeadTime
16 Weeks
Edacad Model
Standard Package
3,672
Supplier Stocks

Technical specifications

Mfr
CUI Devices
Series
HSB
Package
Box
Product Status
Active
Type
Top Mount
Package Cooled
BGA
Attachment Method
Adhesive (Not Included)
Shape
Square, Pin Fins
Length
0.394" (10.00mm)
Width
0.394" (10.00mm)
Diameter
-
Fin Height
0.275" (7.00mm)
Power Dissipation @ Temperature Rise
2.0W @ 75°C
Thermal Resistance @ Forced Air Flow
16.50°C/W @ 200 LFM
Thermal Resistance @ Natural
37.90°C/W
Material
Aluminum Alloy
Material Finish
Black Anodized

Environmental & Export Classifications

RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8473.30.5100

Other Names

-

Category

/Product Index/Fans, Thermal Management/Thermal/Heat Sinks/CUI Devices HSB02-101007

Documents & Media

Datasheets
1(HSB01-080808)
Other Related Documents
1(How to Select a Heat Sink)
Video File
1(How to Select a Heat Sink)
Environmental Information
1(HSB02-101007 RoHS/REACH)
Design Resources
1(Heat Sink Calculator)
Featured Product
()

Quantity Price

Quantity: 5000
Unit Price: $0.44682
Packaging: Box
MinMultiplier: 1
Quantity: 1000
Unit Price: $0.46278
Packaging: Box
MinMultiplier: 1
Quantity: 500
Unit Price: $0.51066
Packaging: Box
MinMultiplier: 1
Quantity: 250
Unit Price: $0.54256
Packaging: Box
MinMultiplier: 1
Quantity: 100
Unit Price: $0.5825
Packaging: Box
MinMultiplier: 1
Quantity: 50
Unit Price: $0.5904
Packaging: Box
MinMultiplier: 1
Quantity: 25
Unit Price: $0.6064
Packaging: Box
MinMultiplier: 1
Quantity: 10
Unit Price: $0.638
Packaging: Box
MinMultiplier: 1
Quantity: 1
Unit Price: $0.67
Packaging: Box
MinMultiplier: 1

Substitutes

-