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Part Number Overview
Manufacturer Part Number
550-10-352M26-001166
Description
BGA PIN ADAPTER 1.27MM SMD
Detailed Description
352 (26 x 26) Pos BGA Socket Gold Through Hole
Manufacturer
Preci-Dip
Standard LeadTime
20 Weeks
Edacad Model
Standard Package
Supplier Stocks
Technical specifications
Mfr
Preci-Dip
Series
550
Package
Bulk
Product Status
Active
Type
BGA
Number of Positions or Pins (Grid)
352 (26 x 26)
Pitch - Mating
0.050" (1.27mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
10.0µin (0.25µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.050" (1.27mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
10.0µin (0.25µm)
Contact Material - Post
Brass
Housing Material
FR4 Epoxy Glass
Operating Temperature
-55°C ~ 125°C
Termination Post Length
0.098" (2.50mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
1 A
Contact Resistance
10mOhm
Base Product Number
550-10
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Other Names
-
Category
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Preci-Dip 550-10-352M26-001166
Documents & Media
Datasheets
()
Video File
1(PRODUCT DESIGN TIPS v017 microPGA Sockets and BGA Adapters)
Environmental Information
1(Preci-Dip Regulatory Info)
HTML Datasheet
1(550-10-yyyMxx-zzz166)
Quantity Price
Quantity: 378
Unit Price: $44.93138
Packaging: Bulk
MinMultiplier: 378
Packaging: Bulk
MinMultiplier: 378
Substitutes
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