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Part Number Overview
Manufacturer Part Number
SMD291AX250T5
Description
SOLDER PASTE SN63/PB37 250G T5
Detailed Description
Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Jar, 8.8 oz (250g)
Manufacturer
Chip Quik Inc.
Standard LeadTime
3 Weeks
Edacad Model
Standard Package
Supplier Stocks
Technical specifications
Mfr
Chip Quik Inc.
Series
-
Package
Jar
Product Status
Active
Type
Solder Paste
Composition
Sn63Pb37 (63/37)
Diameter
-
Melting Point
361°F (183°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
5
Process
Leaded
Form
Jar, 8.8 oz (250g)
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)
allaboutcomponents.com Storage
Refrigerated
Shipping Info
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Weight
0.551 lb (249.93 g)
Base Product Number
SMD291
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8311.30.6000
California Prop 65
Other Names
-
Category
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. SMD291AX250T5
Documents & Media
Datasheets
1(SMD291AX250T5)
MSDS Material Safety Datasheet
1(SMD291AX, SMD4300AX, TS391AX)
HTML Datasheet
1(SMD291AX250T5)
Quantity Price
Quantity: 1
Unit Price: $90.95
Packaging: Jar
MinMultiplier: 1
Packaging: Jar
MinMultiplier: 1
Substitutes
-