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Part Number Overview
Manufacturer Part Number
IC-628-SGG
Description
CONN IC DIP SOCKET 28POS GOLD
Detailed Description
28 (2 x 14) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole
Manufacturer
Samtec Inc.
Standard LeadTime
Edacad Model
Standard Package
Supplier Stocks
Technical specifications
Mfr
Samtec Inc.
Series
IC
Package
Bulk
Product Status
Active
Type
DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
28 (2 x 14)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
30.0µin (0.76µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
30.0µin (0.76µm)
Contact Material - Post
Phosphor Bronze
Housing Material
Polyester, Glass Filled
Operating Temperature
-55°C ~ 125°C
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
1 A
Contact Resistance
10mOhm
Base Product Number
IC-628
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
California Prop 65
Other Names
-
Category
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Samtec Inc. IC-628-SGG
Documents & Media
Datasheets
1(IC Series)
HTML Datasheet
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Product Drawings
()
Quantity Price
-
Substitutes
-