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Part Number Overview
Manufacturer Part Number
PA0189-S
Description
LQFP-176 (0.5MM PITCH, 24X24MM B
Detailed Description
Manufacturer
Chip Quik Inc.
Standard LeadTime
2 Weeks
Edacad Model
Standard Package
Supplier Stocks
Technical specifications
Mfr
Chip Quik Inc.
Series
Proto-Advantage PA
Package
Bulk
Product Status
Active
Type
LQFP
Number of Positions
176
Pitch
0.020" (0.50mm)
Outer Dimension
1.950" L x 1.350" W (49.53mm x 34.29mm)
Inner Dimension
0.945" L x 0.945" W (24.00mm x 24.00mm)
Thermal Center Pad
-
Material
Stainless Steel
Thickness
0.0040" (0.102mm)
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8515.19.0000
Other Names
-
Category
/Product Index/Soldering, Desoldering, Rework Products/Solder Stencils, Templates/Chip Quik Inc. PA0189-S
Documents & Media
Datasheets
()
Video File
1(Prototyping with Solder Stencils - Another Teaching Moment | allaboutcomponents.com Electronics)
HTML Datasheet
1(PA0189-S)
Quantity Price
Quantity: 1
Unit Price: $11.59
Packaging: Bulk
MinMultiplier: 1
Packaging: Bulk
MinMultiplier: 1
Substitutes
-