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Part Number Overview
Manufacturer Part Number
1354298
Description
63S4 WS200 ACP 500G JAR
Detailed Description
Leaded Water Soluble Solder Paste Sn63Pb37 (63/37) Jar, 17.64 oz (500g)
Manufacturer
Harimatec Inc.
Standard LeadTime
Edacad Model
Standard Package
Supplier Stocks
Technical specifications
Mfr
Harimatec Inc.
Series
WS200™
Package
Bulk
Product Status
Obsolete
Type
Solder Paste
Composition
Sn63Pb37 (63/37)
Diameter
-
Melting Point
361°F (183°C)
Flux Type
Water Soluble
Wire Gauge
-
Mesh Type
3
Process
Leaded
Form
Jar, 17.64 oz (500g)
Shelf Life
6 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
32°F ~ 50°F (0°C ~ 10°C)
Shipping Info
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Environmental & Export Classifications
RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
Not Applicable
ECCN
EAR99
HTSUS
8311.30.3000
Other Names
-
Category
/Product Index/Soldering, Desoldering, Rework Products/Solder/Harimatec Inc. 1354298
Documents & Media
Datasheets
()
Product Training Modules
1(Introduction to Solder Paste)
MSDS Material Safety Datasheet
1(1354298 SDS)
PCN Obsolescence/ EOL
1(DK OBS NOTICE)
PCN Packaging
1(Henkel/Berquist Revised Brands 10/May/2016)
HTML Datasheet
()
Quantity Price
-
Substitutes
-