Part Number Overview

Manufacturer Part Number
HSB07-202009
Description
HEAT SINK, BGA, 20 X 20 X 9 MM
Detailed Description
Heat Sink BGA Aluminum Alloy 3.1W @ 75°C Top Mount
Manufacturer
CUI Devices
Standard LeadTime
16 Weeks
Edacad Model
Standard Package
1,872
Supplier Stocks

Technical specifications

Mfr
CUI Devices
Series
HSB
Package
Box
Product Status
Active
Type
Top Mount
Package Cooled
BGA
Attachment Method
Adhesive
Shape
Square, Pin Fins
Length
0.787" (20.00mm)
Width
0.787" (20.00mm)
Diameter
-
Fin Height
0.354" (9.00mm)
Power Dissipation @ Temperature Rise
3.1W @ 75°C
Thermal Resistance @ Forced Air Flow
8.60°C/W @ 200 LFM
Thermal Resistance @ Natural
24.08°C/W
Material
Aluminum Alloy
Material Finish
Black Anodized

Environmental & Export Classifications

RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8473.30.5100

Other Names

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Category

/Product Index/Fans, Thermal Management/Thermal/Heat Sinks/CUI Devices HSB07-202009

Documents & Media

Datasheets
1(HSB07-202009)
Other Related Documents
1(How to Select a Heat Sink)
Environmental Information
1(HSB07-202009 RoHS/REACH)
Design Resources
1(Heat Sink Calculator)
Featured Product
1(Thermal Management Solutions)

Quantity Price

Quantity: 5000
Unit Price: $0.56136
Packaging: Box
MinMultiplier: 1
Quantity: 1000
Unit Price: $0.58141
Packaging: Box
MinMultiplier: 1
Quantity: 500
Unit Price: $0.64156
Packaging: Box
MinMultiplier: 1
Quantity: 250
Unit Price: $0.68164
Packaging: Box
MinMultiplier: 1
Quantity: 100
Unit Price: $0.7318
Packaging: Box
MinMultiplier: 1
Quantity: 50
Unit Price: $0.7418
Packaging: Box
MinMultiplier: 1
Quantity: 25
Unit Price: $0.762
Packaging: Box
MinMultiplier: 1
Quantity: 10
Unit Price: $0.802
Packaging: Box
MinMultiplier: 1
Quantity: 1
Unit Price: $0.84
Packaging: Box
MinMultiplier: 1

Substitutes

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