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Part Number Overview
Manufacturer Part Number
NC191LTA250
Description
SMOOTH FLOW LOW TEMP SOLDER PAST
Detailed Description
No-Clean Solder Paste Bi57Sn42Ag1 (57/42/1) Jar, 8.8 oz (250g)
Manufacturer
Chip Quik Inc.
Standard LeadTime
4 Weeks
Edacad Model
Standard Package
1
Supplier Stocks
Technical specifications
Mfr
Chip Quik Inc.
Series
Smooth Flow™
Package
Bulk
Product Status
Active
Type
Solder Paste
Composition
Bi57Sn42Ag1 (57/42/1)
Diameter
-
Melting Point
279°F (137°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
4
Process
-
Form
Jar, 8.8 oz (250g)
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)
Base Product Number
NC191
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
3810.10.0000
Other Names
-
Category
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. NC191LTA250
Documents & Media
HTML Datasheet
1(NC191LTA250 Datasheet)
Product Drawings
1(NC191LTA250 Datasheet)
Quantity Price
Quantity: 1
Unit Price: $57.95
Packaging: Bulk
MinMultiplier: 1
Packaging: Bulk
MinMultiplier: 1
Substitutes
-