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Part Number Overview
Manufacturer Part Number
51-05-4669-0000
Description
SILVER COPPER EMI SEALANT 681G
Detailed Description
RF EMI EMI Conductive Sealant CHO-BOND® 4669 Polyisobutylene X X
Manufacturer
Parker Chomerics
Standard LeadTime
3 Weeks
Edacad Model
Standard Package
1
Supplier Stocks
Technical specifications
Mfr
Parker Chomerics
Series
CHO-BOND® 4669
Package
Bulk
Product Status
Active
Type
EMI Conductive Sealant
Shape
-
Length
-
Width
-
Thickness - Overall
-
Operating Temperature
-
Adhesive
-
Material
Polyisobutylene
Shelf Life
6 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
77°F (25°C)
Base Product Number
51-05
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
3208.90.0000
California Prop 65
Other Names
-
Category
/Product Index/RF and Wireless/RFI and EMI - Shielding and Absorbing Materials/Parker Chomerics 51-05-4669-0000
Documents & Media
Datasheets
1(Datasheet)
Other Related Documents
1(Part Number Letter Document)
MSDS Material Safety Datasheet
1(CHO-BOND® 4669 SDS)
Environmental Information
1(Parker Chomerics Environmental Cert)
HTML Datasheet
1(CHO-BOND® 4660 and 4669)
Quantity Price
Quantity: 1
Unit Price: $1015.43
Packaging: Bulk
MinMultiplier: 1
Packaging: Bulk
MinMultiplier: 1
Substitutes
-