Mfr
CTS Thermal Management Products
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Included)
Fin Height
0.811" (20.60mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
5.42°C/W @ 200 LFM
Thermal Resistance @ Natural
13.83°C/W
Material Finish
Black Anodized
Base Product Number
APR21